Connector Industry Reports

High-Speed Board-to-Board Connectors


Report Number: P-890-16
Price: $3950.00
Publication Date: August 2016





High-Speed Board-to-Board Connectors

Bishop & Associates research report, High-Speed Board-to-Board Connectors, analyzes high-speed connectors used to connect boards, memory modules, hard drives and solid-state drives in electronic systems and how these connectors are changing as a result of new data center and communications architectures.

  • What are the market drivers that influence the growth of high-speed board-to-board connectors? How important is signal integrity? What standards are impacting the design of board-to-board connectors? What industry trends are driving growth in board-to-board connectors?
  • What refinements in high-speed board-to-board connectors have allowed mezzanine connectors to approach the 25Gb/s system speed?
  • Which board-to-board connector types are anticipated to show the most growth over the next five years? Which types will see a decline?
  • Who are the major suppliers of board-to-board connectors and what segment of the market are they focusing on? How important is cross-licensing of electrically identical products and for which product types has this occurred?

High-Speed Board-to-Board Connectors

Chapter 1 – Report Overview and Definition of Terms

  • Objective
  • Scope of the Study

Chapter 2 – Executive Summary

  • Why Have Connectors at All?
  • 19”Rack Architecture
  • 2U, 4U Packaging
  • 9U Sub-Racks
  • VITA – VME International Trade Association
  • PICMG – PCI Industrial Computer Manufacturers Group
  • Open Compute Open Rack Architecture
  • OpenCloud Connector Specifications
  • Storage Box Architectures
  • Mating Multiple Connectors at Once

Chapter 3 – Discussion of Connector Types

  • Two Row Open Pin Field Connectors
  • Vertical Plug and Receptacle Using Blanked Contacts
  • Array Connectors
  • Open Pin Field Array Connectors
  • Pin in Hole Reflow (PIHR) Connectors
  • Inspection
  • Press Fit Connectors
  • Wafer Style Connectors
  • Screw Machine Connectors
  • Right Angle to Right Angle Connectors to Connect Coplanar Boards
  • Vertical Edge Card Connectors
  • Riser Cards
  • Pluggable Modules
  • Memory Connectors
  • Modules
  • SODIMM
  • MiniDIMM
  • Angled DIMM
  • JEDEC
  • Storage Connectors
  • SAS (Serial Attached SCSI)
  • SATA (Serial ATA)
  • SCA-2
  • Micro SATA
  • Slimline SATA

Chapter 4 – Industry Standards

  • IEC – International Electrotechnical Commission
  • ANSI – American National Standards Institute
  • IEEE – Institute for Electrical and Electronic Engineers
  • PICMG
  • AdvancedMC™ (AMC)
  • MicroTCA®
  • MicroTCA MCH Plug Solutions
  • COM Express® Modules
  • VITA – VME International Trade Association
  • VITA 42 XMC Connector
  • VITA 57 FMC Connector
  • VITA 61 Rugged XMC Connector
  • PCI-SIG
  • PCI Express®
  • PCI Express Mini Card
  • M.2
  • MXM 3.0
  • SFF-SIG
  • PISMO™ Platform Independent Storage

Chapter 5 – High-Speed Board-to-Board Connector Supplier Profiles

  • TE Connectivity
  • TE Mictor
  • TE Mictor SB
  • TE Mezalok
  • TE STRADA Mesa
  • TE HM ZD Mezzanine
  • Samtec
  • Samec Q-Strip®
  • Samtec Q2™ Shielded
  • Samtec Edge Rate™ Connectors
  • Samtec High Speed Edge Card Connectors (HSEC)
  • Samtec Razor Beam™ System
  • Samtec Q Rate™
  • Samtec SamArray®
  • Samtec SEARAY Connector
  • Samtec SEARAY-LP
  • Samtec Z-Ray® Interposers
  • Samtec SkyRay™
  • Amphenol-TCS
  • Amphenol-TCS Strategy
  • Amphenol-TCS NeXLev®
  • Amphenol-TCS InfinX™
  • Amphenol-TCS XCede®
  • Amphenol-TCS Paladin®
  • Amphenol High-Speed Edge-27
  • Amphenol Lynx
  • Amphenol-TCS Aptera™
  • Amphenol-TCS VHDM® Stacker
  • Molex
  • Molex/Samtec SEARAY
  • Molex/Samtec HD MEZZ™
  • Molex NeoScale® High-Speed Mezzanine
  • Molex NeoPress® High-Speed Mezzanine
  • Molex HS Dock+™ System
  • Molex SpeedStack™
  • Molex Edgeline®
  • Molex Edgeline® 25
  • Molex CoEdge
  • Molex Impact Stacker
  • Hirose
  • Hirose Strategy
  • Hirose FX10
  • Hirose FX11
  • Hirose FX12
  • Hirose IT3
  • Hirose IT5/Samtec SkyRay
  • Hirose XG1
  • Hirose FX18 RA/Coplanar
  • Amphenol FCI
  • Amphenol FCI Meg-Array®
  • Amphenol FCI Gig-Array®
  • Amphenol FCI TwinMezz®
  • Amphenol FCI ExaMezz®
  • JAE
  • JAE WA6
  • JAE TX24A/TX25A
  • JAE WD2
  • JST
  • JST JMD Connector
  • JST JMC Connector
  • JST Vertical SO DIMM 144
  • Advanced Interconnect
  • Advanced Interconnect B2B® Mezzanine
  • HARTING
  • HARTING con:card+®
  • HARTING AMC Plug
  • Yamaichi
  • Yamaichi AMC and MicroTCA Compression
  • ERNI MicroSpeed®
  • Fujitsu Differential Connector

Chapter 6 – Observations and Conclusions

  • Observations and Conclusions

Chapter 7 – Statistical Analysis

  • High-Speed Mezzanine Connectors by Connector Type and Region 2014 and 2015 with Percent Change
  • Storage Connectors by Product Type and Region 2014 and 2015 with Percent Change
  • DIMM Modules by Type and Region 2014 and 2015 with Percent Change
  • High-Speed Mezzanine Connectors by Connector Type and Region 2015 and 2016F with Percent Change
  • Storage Connectors by Product Type and Region 2015 and 2016F with Percent Change
  • DIMM Modules by Type and Region 2015 and 2016F with Percent Change
  • High-Speed Mezzanine Connectors by Connector Type and Region 2016F and 2021F with 5-Year CAGR
  • 2016F High-Speed Mezzanine Connectors by Region
  • 2021F High-Speed Mezzanine Connectors by Region
  • High-Speed Mezzanine Connectors by Type 5-Year CAGR 2016F to 2021F
  • Storage Connectors by Product Type and Region 2016F and 2021F with Percent Change
  • 2016F Storage Connectors by Region
  • 2021F Storage Connectors by Region
  • DIMM Modules by Type and Region
  • 2016F DIMM Modules by Region
  • 2021F DIMM Modules by Region

Appendix A – Terms and Definitions

Appendix B – Connector Speeds and Multiple Sourcing

Appendix C – Stack Heights Available by Connector Family

Appendix D – Connector Families Based on Bishop Category

High-Speed Board-to-Board Connectors

Bishop and Associates Inc. announces the release of a new seven-chapter, 215-page research report analyzing High-Speed Board-to-Board Connectors.

This report analyzes electronic packaging trends and evolutionary changes that influence high-speed board-to-board connector designs. It explains what connector families best fit architectures including medical, industrial, mil-aero, server racks, switches, large routers, standard card cages and 1U boxes. Mezzanine connector standards are also explained allowing readers to find the connector and standard that best fits their application.

Connector product managers, design engineers, procurement teams, and financial analysts will all find valuable information in this report enabling them to develop winning strategic plans for their products and companies. OEM management, design and procurement can use the information in this report to make knowledgeable decisions about architectural and interconnect strategies most likely to give them a competitive advantage in their markets. Tables in the report show what stack heights and pin counts are available for various configurations and signal integrity requirements.

This report focuses on high-speed mezzanine, edge cards, memory, and storage connectors designed for data rates from 10 to 56Gbps. Offerings from all the major high-speed board-to-board connector suppliers are described, compared, and contrasted, allowing readers to quickly identify the right connector families and suppliers most likely to meet their specific needs for mechanical and electrical performance.

This report excludes some categories not considered important enough, and different enough, to warrant their own deep dive. Not included in this report are backplane connectors, power, cable solutions, flex circuit connectors, and fiber optic systems. Microminiature connectors, such as those used in laptops and phones, are also excluded.

Fundamental strategies, range of offerings, and direction is explained for each supplier. It becomes easy to see how connector manufacturers collaborate, compete, and differentiate themselves from competitors.

As data rates reach beyond 56Gbps, connector designs need to be finely tuned for tight impedance control and reduced crosstalk. This report illuminates how the highest speed connectors are able to achieve these data rates while still maintaining high density and robust construction.

Market size and forecast data are provided by connector types including:

  • Open pin field mezzanines
  • Stripline dual row connectors
  • Drive connectors
  • Backplane style mezzanine connectors
  • High-speed edge card connectors
  • Memory sockets

Financial firms seeking investment opportunities in the connector space will benefit from the insight provided in this report regarding market attractiveness, competitive positioning and important market trends that will drive future growth.

This report is also a great tutorial about the range of connector options available from major manufacturers, the strengths and limitations of various systems and technology, and second sourcing strategy. This information combined with informative tables showing what stack heights, configurations, pin counts, and data rates are available from the various families provides guidance for OEM design and procurement people, as well as distributor sales people and product managers, who need to guide their customers to the best interconnect for each application.

A family of printed circuit board connectors (PCB) that have evolved significantly over the last decade, high-speed board-to-board connectors have entered into design areas few would have thought possible just a few years ago. Couple this with the number of pin and height variations required to satisfy the needs of the various system developers and the design parameters can become daunting! This report analyses those parameters, and provides an overview of both existing and newly developed products, allowing the reader to intelligently categorize and quantify the market for high-speed board-to-board connectors.

Connector sales by region and high-speed board-to-board connector type, DIMM module and selective board level storage connectors are provided for the years 2014, 2015, 2016F and 2021F with a 5-year CAGR.

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Download a descriptive brochure here