Connector Industry Reports

Electronic Industry and Connector Outlook 2018 and Beyond


Report Number: M-960-18
Price: $3950.00
Publication Date: November 2018





The electronic industry, now entering its 75th year, has been driven by changes in semiconductor technology, successive generations of change in electronic equipment, and more recently, software developments. It is important for companies in the connector industry to understand these changes, because the next decade will see multiple paradigm shifts that will affect the industry, its customers, and suppliers. Order your copy of Electronic Industry and Connector Outlook 2018 and Beyond to gain an understanding of how these changes will affect the connector and electronics industry.

Electronic Industry and Connector Outlook 2018 and Beyond

Chapter 1 - Synopsis
  • Synopsis
  • Table 1.1 Future Paradigm? Systems on Chip, Lightwave Systems
  • Today
  • Table 1.2 Semiconductor Dollar Consumption Percentage by Region
  • Tomorrow
  • Table 1.3 World Electronics Industry Revenue Model 2017-35
  • North American Region View
  • Table 1.4 World Electronics Industry Revenue Model with Recession and Slower China Growth 2017-30
  • Table 1.5 Example: World Automotive Connector Sales Projection
  • Connector View
Chapter 2 – Aerospace
  • 2.1 Aerospace/Military
  • 2.2 Future
  • Chart 2.1 World Commercial Aircraft Production 2009-2037
  • 2.3 Future Military Aerospace
  • 2.4 Future Commercial Aviation
  • 2.5 Connector Market and Mil/Aero Expenditures
  • Table 2.1 DOD Expenditure (US$) by Country – 2017 Fact Sheet SIRI Military Expenditure Database
  • Chart 2.2 International Expenditures DoD 2016 in US Dollars
  • 2.6 The Incredible Diversity of Mil/Aero Applications
  • B21 Mission
  • 2.7 Mil/Aerospace Roadmap
    1. Commercial Aviation
    1. Defense Spending
  • 2.8 Robot Future
  • 2.9 Naval Buildup
  • Table 2.2 Aerospace-Mil Connector Industry Forecast
  • Table 2.3 Bishop Connector Forecast and Outlook 2018-25
  • Chart 2.3 Mil/Aero Connector Outlook 2017-2035
Chapter 3 – Transportation Market Segmentation
  • 3.1 Passenger Cars and Light Trucks
  • Major OEMs
  • Table 3.1 World Auto Unit Sales w/o EV Economics
  • Table 3.2 World Auto Sales by Type w/Infrastructure Up and Battery Costs Down
  • Table 3.3 World Auto Units Sales by Type with Gas More Than $5.00 2016-2028
  • 3.2 Automotive Trends
  • Table 3.4 Ride Share Impact on Annual World Vehicle Sales 2018-28
  • Major Trends
  • At the Interconnect Level
  • 3.3 Heavy Trucks
  • Technology Trends
  • 3.4 Railroads
  • Locomotive Manufacturers
  • Current Threat Reductions
  • Technology Developments
  • Table 3.2 World Automotive Connector Sales Projection 2016-30
  • World Automotive Connector Sales Projection by Region 2016 through 2030
Chapter 4 – Semiconductors
  • 4.1 Scope & Situation Analysis
  • Table 4.1 Worldwide Semiconductor Revenues Year-to-Year Percent Change
  • Table 4.2 US Shipments Computers & Electronic Products Including Semiconductors
  • Table 4.3 Total US Manufacturing in Millions of Dollars 1992-2026
  • Table 4.4 World Semiconductor Sales Dollars 1987-2028 (trend)
  • Table 4.5 World Semiconductor Sales Trend 1987-2028
  • Table 4.6 World Semiconductor & Connector Sales Trendline Analysis 1987-2028
  • Table 4.7 World Sales of Connector Products 1980-2028
  • 4.2 The Current Situation
  • 4.3 IC Technology Trends
  • New Materials, Processes, and Devices
  • Table 4.8 Memory Chip Performance 2015-2030
  • Table 4.9 Memory Chip Performance 2015-2030
  • Beyond 5nm
  • From INEMI 2017 Roadmap
  • 4.4 Summarizing the Semiconductor Linkage
  • 4.5 Semiconductor Test and Burn-In (TBI)
  • Critical Test and Burn-In Issues
  • 4.6 Test Socket Technology Trends
  • Standards
  • 4.7 Market Factors – Competitors in the Burn-In and Test Market Segment
  • Key Design Issues
  • Key Points
  • Major Roadblocks
  • 4.10 Test and Burn-In Socket Roadmap 2009-2028
  • 4.8 Test-in-Tray
  • Table 4.11 Magazine Test and Burn-In 2009-28
  • Test Equipment by process of Semiconductor
  • Table 4.12 Burn-In and Test Socket plus Specialty Socket/Adapter Market Est. 2018-28
Chapter 5 – Silicon Photonics
  • 5.1 Introduction
  • Table 5.1 Cloud Computing/Data Center Market 2016 - 2028
  • 5.2 Notes from MIT-INEMI Technology Roadmapping Consortium Conferences and Webinars
  • Figure 5.1 TSV Wafer Starts 2013-2021
  • 5.3 IPSR Mid-Board Proposal
  • Background
  • INEMI-MIT-AIM Photonics Interconnect Project Status
  • Mid-Board Interconnect Project
  • Generic On-Board Optical Interconnect-Optical Connectors Example
  • Companies Participating in AIM Funding
  • 5.4 Introduction to Connector Roadmap
  • The Interconnect TWG Encompasses the Following Technologies
  • Crosscutting Technologies covered in Packaging TWG
  • Technology Needs in Interconnect TWG
  • Probable Future Interconnect Product Designs (and Challenges)
  • Critical Interconnect Issues in this Program
  • 5.5 Paradigm Shifts
  • 5.6 Situation Analysis – All Connectors
  • Table 5.2 Some Leading Connector Manufacturers
  • Table 5.3 Connector Levels of Packaging
  • 5.7 Situation Analysis-Printed Circuit Boards
  • Printed Circuit Board Manufacturing
  • 5.8 Roadmap of Photonic Connectors
  • Table 5.4 Technology Roadmap: MXC Single-mode Fiber Optic Connector 2000-2025+
  • Table 5.5 Technology Roadmap: MPO Single-mode Fiber Optic Connector 2000-2025+
  • Table 5.6 Technology Roadmap Active Optic Cable Assembly (AOC) 2015-2025
  • Table 5.7 Technology Roadmap Generic MM to SM Fiber Optic Connectors 2015-2025+
  • Table 5.8 Technology Roadmap Generis High Perf. (≥10G) Backplane Connectors 2000-2025+
  • Table 5.9 Technology Roadmap Discrete Optical Interposer 2015-2025+
  • 5.9 Experiments
  • Concept On-Board Optical Interconnect – Optical Connectors
  • Electronically-Pluggable Silicon Photonics Module, with Fly-Over Optical Fiber Cables
  • Module Reflowed on PCB with Embedded Waveguides
  • Three Phases to Prove out Single-mode Expanded Beam Server Blade Interconnect
  • 5.10 Fiber Optics Technology
  • Background
  • Table 5.10 Fiber Optic Deployment
  • Internecine Roadblocks for Fiber Deployment in System Packaging
  • General Roadmap Dialog
  • Available Elements of a Photonic System
  • Future Breakthroughs
  • Table 5.11 General Fiber Optic Connector Roadmap
  • 2018-2028-2038
  • Connector Technology Trends
  • Optical Backplanes
  • 5.11 Needs for Full Photonics Adoption by Industry
  • OEM Buy-In to Silicon Photonic Systems Technology
  • Collaboration and Input from the Interconnect Industries
  • Specific Technology Input
  • Technology Needs
  • 5.12 Gaps & Show-Stoppers
Chapter 6 – Other Markets
  • 6.1 Office Equipment/Institutional Markets
  • Computers – Peripherals Sector
  • Table 6.1 Computer & Office Equipment Connector Market 2018-2028
  • 6.2 Office Equipment Suppliers
  • 6.3 Office Equipment Market Situation
  • Global Market Conditions
  • Regional View
  • Overall
  • 6.4 Medical Electronics
  • Table 6.2 Medical Electronics Global Market Est 2015-28
  • 6.5 Key Player
  • 6.6 Medical Device Companies
  • 6.7 Connector Products
  • Table 6.3 Connector Sales in Medical Equipment
Chapter 7 – Robotics
  • 7.1 Scope
  • 7.2 Robotics Revolution
  • 7.3 Impact on Employment
  • 7.4 Robotics Market
  • Table 7.1 Robotics Market 2018 – 25/28
  • 7.5 Robot Manufacturers
  • Manufactures by Numbers Installed
  • Table 7.2 Robot Manufacturers
  • Table 7.3 Robot Manufacturers by Base of Origin with Total Number of Installed Robots
  • 7.6 Implications of Robotics Impact on Electronics Industry and Connectors
  • Table 7.4 Regional Industrial Connector Outlook 2018-28
Chapter 8 – Information Technology
  • 8.1 Definitions
  • 8.2 Interconnect Trends
  • 8.3 Interconnect Levels of Packaging
  • 8.4 Computer Market Characteristics Going Forward
  • 8.5 Computer Market and Technology Disruptions
  • 8.6 Top PC and Server Manufacturers
  • Table 8.2 Regional Computer Manufacturers
  • Table 8.3 Top PC, Notebook, and Server Manufacturers 2017 by Country of Origin
  • 8.7 Observations & Outlook
  • Table 8.4 World Computer/Peripherals & Office Equipment Connector Forecast & Outlook 2018-28
  • Table 8.5 World Computer & Peripheral plus Office Equipment Connector Forecast & Outlook 2018-35
  • System Comments
  • Interconnect Comments
  • 8.8 Competition
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Bishop and Associates Inc. announces the release of a new eight-chapter, 196‐page research report providing a high altitude look at several major connector markets, including aerospace, military, transportation, semiconductor, robotics, computers, medical electronics, and silicon photonics. The report identifies key trends over the next decade and how they will impact connector sales.

The electronic industry is entering its 75th year, driven by semiconductor technologies, successive generations of electronic equipment, and more recently, software developments. These forces affect everything – down to the nuts and bolts of the industry – i.e. connectors. It behooves the connector industry to understand these changes, because the next decade will see multiple paradigm shifts that will affect the industry, its customers, and suppliers.

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The connector industry is mature, has consolidated, and still includes many niche players. Since all electrical, and most electronic devices require physical connections, this industry will be around for many years to come. However, to achieve more than single-digit/cyclical growth, horizontal and vertical integration in this industry may be significant to future growth. The caveat is to not undermine your core business in the process.

Download a descriptive brochure here